IC Packaging Thermal-Mechanical Modeling Summer/Fall Coop
We are offering an exciting Summer/Fall Co-op opportunity at Skyworks for IC Packaging Thermal-Mechanical Modeling Intern to join our dynamic engineering team starting June 2024. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in thermal/mechanical modeling and characterization of IC packages. You will be introduced to the basics of the IC design and manufacturing process flow at our world class design centers, manufacturing facilities and labs. Overtime this position has potential to become Skyworks full time employee. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of Skyworks success.
- Become familiar with various IC packaging structures and the process steps involved in making the end product.
- Learn the basics of using numerical analysis tools such as ANSYS, Icepak etc.
- Start developing simple package level mechanical Finite Element Analysis (FEA) Models to characterize stress/strain in the packages due to various assembly process steps.
- Start developing simple FEA models to capture the various accelerated testing conditions that ensures long term package reliability.
- Become familiar with the fundamentals of heat transfer in IC packages and the various thermal related nomenclatures and parameters as specified in standards documents.
- Start developing thermal FEA models to characterize the package level thermal resistance and other thermal performance parameters.
- Learn to use statistical tools such as JMP to create statistical models that can predict DPPM level failure rates in high volume manufacturing.
- Learn to interpret the thermal/mechanical behavior of models and simulation results and correlate to observed behavior and measurements.
- Document all simulation models, codes and scripts and present the results in simple and clear terms to a broader audience.
Qualifications and Education Requirements
- Currently pursuing a Bachelor's or Master's degree in Mechanical Engineering, Materials Science, or a related field.
- Strong interest in heat transfer, solid mechanics, finite element analysis and its applications in semiconductor packaging.
- Strong problem-solving and analytical skills.
- Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment.
- Familiarity with FEA software (e.g., ANSYS, COMSOL) is a plus, but not mandatory. Willingness to learn and apply FEA techniques is essential.
- Basic understanding of semiconductor packaging concepts and materials is advantageous.
- Proficiency in using CAD tools for package modeling is a bonus.